Erkoç İmalat Ltd. Şti.

It is produced by expanding the copper plate and is a very efficient grounding element since it establishes contact with the ground in a far better way because of its pores.

Production: Produced by the expansion of 1,5 and 2 mm thick copper plates.

Installation: Buried to a 50 cm depth parallel to the surface.

Resistance Reducer: A very efficient spreading resistance is obtained when Resistance Reducing (Ultrafill) Chemical Dust is applied to upper and lower sides.

Technical Specifications

Dimensions: 1- 50 x 100 x 0,25 mm
                        2- 100 x 100 x 0,25 mm
                        3- 50 x 100 x 0,40 mm
                        4- 100 x 100 x 0,40 mm

Connection Section: There is 50 mm2 copper for 1 m conection on each, as well as silver welding connection.

Advantage: There is no need to dig a deep hole since it is a horizontal application.